Physical Design

  • Planning for floor layout, power distribution, and I/O configuration
  • Design Rule Checking (DRC) and Layout Versus Schematic (LVS) testing and verification.
  • Performance analysis, including power consumption, signal integrity, and IR drop analysis.
  • Estimation of die area for macros/IOs, including calculations based on pad and logic block areas.
  • Complete chip design, including packaging and closure.
  • Design partitioning and hardening.
  • Timing closure sign-off.
  • Verification of physical design
  • Implementation of low-power design.
  • Analysis of static timing (STA).
  • Advanced FinFET technologies at deep nodes.